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Blue, aqua and grey LC fibre-optic connectors with yellow and aqua cables on a circuit pattern — data-centre optical components
Data-centre fibre-optic connectors (LC) — thin-wall housings around 1 mm, where a high-flow PESU grade is used; colour codes the fibre type. Photo: BASF press image

For data-centre part designers PEI is the long-standing default. Can PESU take that place? We set the two datasheets side by side on identical test methods and gave a verdict part by part. With PEI supply unsettled in 2026, this is the comparison we are asked for most.

The short version
1

Same tier, same character

PEI and PESU are both amorphous, transparent-amber, inherently flame-retardant super-engineering plastics, and their processing windows overlap. That is why running a PEI mould on PESU is a realistic conversion.

2

On heat, impact and arc, PESU leads

On identical methods: UL relative temperature index 180–190 vs 170°C, heat deflection 205 vs 192°C, notched impact 7.5 vs 4 kJ/m², high-amp arc ignition PLC 0 vs 3–4. The 'lower thermal expansion' SABIC's brochure claims is the same value in both TDS (52 E-6/K).

3

On thin-wall flame rating and GHz dielectrics, PEI leads

If V-0 at 0.75 mm is required, or GHz signals pass through the housing of a high-speed electrical connector, PEI is the right call. For the rest — fibre-optic connectors, cooling fittings, fans, power-distribution parts — PESU wins on both the data and the supply.

PEI is polyetherimide, an amorphous high-temperature resin supplied by SABIC under the ULTEM trademark. It has been used in connectors, IC trays and aircraft interiors since the 1980s, and in data centres it is specified almost by default for fibre-optic connector housings, insulating parts in server power stages and cooling-system fittings.

PESU is polyethersulfone, the member of the sulfone family (PSU, PESU, PPSU) with the highest glass-transition temperature. BASF supplies the family under the Ultrason trademark; PESU is the Ultrason E series. In October 2026 BASF extended Ultrason into AI data-centre, high-speed connectivity and e-mobility E&E parts and positioned it as an alternative to PEI, PEEK and PAI (see the linked article below).

The two sit in the same box of the plastics ladder. Both are amorphous, so dimensionally stable and transparent; both are amber-transparent; both reach UL94 V-0 without flame-retardant additives. Melt temperatures overlap — PESU 340–390°C, PEI 350–410°C. The comparison is a fair one, which is exactly why it has to be made item by item.

The three tiers of plastics — both materials sit in the same box
150°C and aboveelectronics, aerospace, medical
Super-engineering plastics
PESUPEIPPSUPEEK
100–150°Cmachinery, electronics
Engineering plastics
PCPAPBTPOM
below 100°Cpackaging, household
Commodity plastics
PPPEPS
PESU= Both materials herePC= Ordinary connectors, housingsPP= not compared
The industry's three-tier classification by continuous service temperature. Grades within a tier differ; this article compares the unreinforced injection-moulding grades of each maker.

Source: Industry classification · manufacturer literature

The two materials and their makers
PESUPEI
MakerBASF SESABIC
TrademarkUltrason EULTEM
Grades comparedE 1010 (low viscosity, high flow) · E 2010 (standard)1000 (standard) · 1010 (high flow)
TDS editionFebruary 20262026 (SABIC Material Finder)
Production in KoreaYeosu plant — on stream 2014, expanded 2018 full S, E and P range to the same specification as LudwigshafenNone — imported
Supply in KoreaOctud local stock (E 1010 · E 2010)Import distributors

Source: BASF news release P163/18e (11 April 2018) · product TDS

The grades compared are Ultrason E 1010 and E 2010 for PESU and ULTEM 1000 and 1010 for PEI. Each pair is built the same way — a standard-viscosity grade and a high-flow grade. E 1010 is the low-viscosity grade BASF positions for thin-wall LC and MPO connectors; ULTEM 1010 is the grade SABIC describes as 'improved flow'. All four are unreinforced injection-moulding grades, and only items measured by the same international method in both TDS were used. UL items are UL Yellow Card values for both makers.

The PEI datasheets list ISO and ASTM values side by side. We used the ISO values, and where no ISO value exists (UL 746A/B) the UL values. All figures are typical values at 23°C, dry, not specification limits.

Data-centre operating conditions and the two materials' upper limits
Server inlet air · ASHRAE A4 allowable
upper band for air-cooled data centres
5–45°C
Connector reliability test · 85°C / 85% RH
BASF fibre-optic connector test condition
85°C
PESU
Ultrason E 2010 · HDT 205°C → Tg 225°C
PEI
ULTEM 1010 · HDT 192°C → Tg 217°C
050100150200250
Up to the loaded service limit (HDT 1.8 MPa)From HDT to the softening point (Tg)Use condition
Both materials top out more than 100°C above any data-centre environment. The difference shows above that — solder heat, a coolant leak, local heating in a power part: the margin left on the exceptional day.

Source: ASHRAE TC 9.9 thermal guidelines (A4: 5–45°C) · BASF Ultrason E&E page · product TDS

Datasheet comparison — identical test methods only
ItemMethodPESU · E 1010 / E 2010PEI · ULTEM 1000 / 1010
Glass transitionwhere the material starts to softenISO 11357222 / 225°C217°C
Heat deflection (1.8 MPa)where it starts to bend under loadISO 75203 / 205°C192°C
Relative temperature index RTIelectrical · impact · strengthUL 746B180 · 180 · 190°C170 · 170 · 170°C
Tensile modulusstiffnessISO 5272,650 / 2,640 MPa3,200 MPa
Yield stressISO 52785 / 86 MPa110 MPa
Yield strainhow far it bends before permanent setISO 5276.8 / 6.9 %6 %
Notched impact 23°Cresistance at scratches and cornersISO 179/1eA6.5 / 7.5 kJ/m²4 kJ/m²
Notched impact −30°CISO 179/1eA6.5 / 8 kJ/m²4 kJ/m²
Unnotched impactISO 179/1eU · 180/1Uno breakno break
Thermal expansionISO 1135952 E-6/K52 E-6/K
DensityISO 11831.37 g/cm³1.27 g/cm³
Water absorption (23°C, saturated)ISO 622.2 %1.25 %
UL94 V-0 minimum thicknessUL 94E 1010: 3 mm (V-1 at 1.5 mm) / E 2010: 1.5 mm0.75 mm
UL94 5VA minimum thicknessUL 94E 2010: 3 mm (not listed for E 1010)3 mm
High-amp arc ignition HAI(PLC 0 is best)UL 746AE 2010: PLC 0 / E 1010: PLC 1–2PLC 3 (≥3 mm) · PLC 4 (≥0.75 mm)
Hot-wire ignition HWIUL 746APLC 1–3PLC 1 (≥3 mm) · PLC 2 (≥0.75 mm)
Comparative tracking index CTIUL 746A PLC · IEC 60112PLC 4 · 125 VPLC 4 · 150 V
Dielectric strengthIEC 60243-137 kV/mm25 kV/mm (1.6 mm, in oil)
Permittivity (1 MHz)IEC 62631 · 602503.82.9
Melt · mould temperatureTDS recommendation340–390 · 140–180°C350–410 · 135–180°C

PESU values are E 1010 / E 2010; where ULTEM 1000 and 1010 share a value it is given once. All typical values, not specification limits. For HAI and HWI the PLC (performance level category) is better the lower the number.

Source: BASF Ultrason E 1010 NAT · E 2010 NAT TDS and UL Yellow Card E41871 (February 2026) · SABIC ULTEM 1000 · 1010 Global TDS and UL Yellow Card E121562 (2026)

What the table says

On heat, PESU is a notch higher. +5–8°C on glass transition and +11–13°C on heat deflection look small, but the gap becomes clear in the relative temperature index UL derives from 20,000-hour ageing: electrical and impact RTI 180 vs 170°C, strength RTI 190 vs 170°C — the same UL 746B basis. For connectors that pass reflow soldering or insulating parts near a power stage, where thermal history accumulates, that 10–20°C comes back as service-life margin.

On impact, PESU is clearly higher. Notched impact 7.5 vs 4 kJ/m² (E 2010 vs ULTEM), and 8 vs 4 at −30°C. This is the value that counts where stress concentrates — scratches, corners, gate marks — and the root of a snap-fit hook is exactly such a place. More on that below.

For power parts, look at arc-ignition resistance. UL 746A's HAI (high-amp arc ignition) grades how many arcs a material survives before igniting. E 2010 holds the best category, PLC 0; ULTEM is PLC 3–4. For busbar holders, breaker latches and fuse holders — data-centre power-distribution parts where arcing is possible — this item matters as much as the UL94 rating.

PEI leads on clear items of its own. Tensile modulus is 20% higher and yield stress higher (good for stiff structural parts). Density is 7% lower and saturated water absorption lower. Permittivity at 1 MHz is 2.9 against PESU's 3.8, so signal loss is lower where high-speed electrical signals pass through a housing. And it holds UL94 V-0 at 0.75 mm — E 2010 at 1.5 mm, E 1010 only V-1 at 1.5 mm. If V-0 is a specification requirement at wall thicknesses of 1 mm or less, narrow the choice to E 2010 or BASF's D series (PESU blend) and confirm.

SABIC's comparison brochure should be re-read against the TDS. SABIC's 'ULTEM as an alternative to sulfone polymers' claims 'up to 17% lower CTE than PES/PPSU', but the ISO 11359 values in both TDS are identical: 52 E-6/K for PESU and PEI. 'Up to 55% higher stiffness' is against PSU; against PESU it is about 20%. A maker's brochure naturally chooses the comparison targets and conditions that favour its own material, which is why the same-method TDS values are the place to return to.

Three copper conductors with white extruded insulation — two flat, one round — with bare copper showing at the ends
Flat and round copper conductors insulated with a sulfone polymer. For insulating parts around current-carrying conductors, the long-term temperature index (RTI) and arc-ignition resistance (HAI) are read alongside the UL94 rating. Photo: BASF press image
Verdict by data-centre part
Part · requirementPESU (E 1010 / E 2010)PEI (ULTEM 1000 / 1010)
Fibre-optic connector housing (LC, MPO) · ~1 mm thin wall · 85/85 · low shrinkageSuitable — E 1010 high flow, passed BASF 85°C/85% RH test, shrinkage 0.8–0.9%Suitable — the incumbent material, shrinkage 0.5–0.7%
Liquid-cooling fittings and manifolds · continuous glycol coolant contact · hydrolysisAdvantage — sulfones are proven in repeated 134°C steam sterilisationPossible — maker states hydrolytic stability; long hot-wet exposure to be confirmed
Fan blades, air shrouds · dimensional stability · continuous rotation at temperatureAdvantage — strength RTI 190°C, identical CTESuitable — 20% higher stiffness
Busbar holders, breaker latches, fuse holders · arc and hot-wire ignition · CTIAdvantage — E 2010 HAI PLC 0, electrical RTI 180°CPossible — HAI PLC 3–4, slight edge on CTI 150 V
High-speed electrical connector housing · GHz signals · low permittivityConditional — permittivity 3.8Advantage — permittivity 2.9, 10 GHz loss 0.0027
Wall thickness 0.75 mm or less · V-0 requiredE 2010 V-0 at 1.5 mm — decide after checking wall thicknessAdvantage — V-0 at 0.75 mm
Snap-fit parts · repeated engagementAdvantage — lower modulus, higher yield strain, twice the notched impactPossible — less margin at the hook root
IC trays, test sockets · dimensional stability · low outgassingSuitable — BASF semiconductor applicationSuitable — the incumbent material

'Advantage' = one side clearly ahead on datasheet and maker application literature; 'Suitable' = both are used; 'Conditional / Possible' = a condition needs confirming. This does not replace part-level qualification testing.

Source: Product TDS · BASF 'Ultrason® for E&E' (2023) · BASF Ultrason E&E page · SABIC ULTEM application literature

Glossary — in plain terms
RTI (relative temperature index)
The continuous service temperature, set by UL 746B long-term ageing, at which a property has not fallen to half. Given separately for electrical, impact and strength.
HDT (heat deflection temperature)
The temperature at which a specimen under 1.8 MPa bends by a set amount as it is heated. The practical upper limit for a loaded part.
Glass transition (Tg)
The temperature at which an amorphous plastic loses its rigidity and starts to soften.
HAI · HWI
UL 746A high-amp arc ignition and hot-wire ignition tests. PLC (performance level category) 0 is best; the higher the number, the more easily it ignites.
CTI (comparative tracking index)
The voltage at which insulation begins to break down across a contaminated surface. Higher is better; also expressed as a PLC.
UL94 V-0 · 5VA
Vertical-burn ratings. V-0 self-extinguishes within 10 s without flaming drips; 5VA survives a stronger flame without burning through. Always quoted with a minimum thickness.
Notched impact
The energy needed to break a notched specimen. Shows how a material holds at scratches, corners and gate marks.
85/85 test
An electronics reliability test — prolonged exposure at 85°C and 85% relative humidity, followed by property and dimension checks.
Octud note

In a snap-fit, 'lower stiffness' becomes an asset. A lower modulus means lower stress at the hook root for the same deflection, and a higher yield strain (6.8–6.9 vs 6%) means more bend before permanent set. Add notched impact nearly twice as high and a latch or cover clip that is engaged repeatedly has more margin against fracture in PESU. The reverse holds for a thin, long structural part that must not deflect: there the stiffer PEI is right. 'Stiffness' is not good or bad — it is a question of what the part does.

On flow, conversions in Korea and abroad have reported PESU ahead. The two makers test melt flow under different conditions (PESU 360°C/10 kg, PEI 337°C/6.6 kg), so the datasheet figures cannot be placed side by side. What can be said: in conversions that ran an existing PEI mould on PESU, in Korea and elsewhere, better thin-wall fill and surface have been reported, and the same assessment recurs in the enquiries Octud receives. E 1010 is the low-viscosity grade BASF positions for thin-wall connectors (MVR 150), and its melt window sits 10–20°C below PEI's. The fastest check is a spiral-flow or short-shot trial in the existing mould; Octud supplies evaluation samples.

Supply security became the most-asked question of 2026. Since the Middle East events of spring 2026, enquiries about alternative materials have risen, citing unsettled PEI lead times and allocation (as received by Octud). PESU's position is different. BASF produces Ultrason to the same specification in Ludwigshafen, Germany and at its Yeosu plant in Korea — the first Ultrason plant in Asia, on stream since 2014 and expanded in 2018 to take global capacity to 24,000 t/a. Domestic production removes sea freight and customs from the equation, and with Octud holding E 1010 and E 2010 in local stock, supply comes down to domestic logistics. The datasheet itself states that 'to ensure supply ability, our products are produced in several production lines on different sites of the BASF Group… to identical specifications.'

On price, PESU generally sits below PEI. Its 7% higher density adds a little to the material weight of a given part, but the difference in price per kilogram is larger than that. The real cost of conversion is re-qualification, not resin: UL component recognition, connector standards (IEC 61754 and the like) and customer approval tests must be repeated when the material changes, and this datasheet comparison does not replace them. Octud bundles both materials' TDS, UL Yellow Cards and BASF application literature into a conversion-review package.

In short. If V-0 at 0.75 mm or GHz dielectric performance is a design requirement, choose PEI. If neither is — fibre-optic connectors, cooling fittings, fans, power-distribution parts, snap-fit joints — the datasheet's heat, impact and arc items and the supply security of domestic production point the same way. Where a PEI alternative is being sought, PESU is not the 'alternative' — it is the material to review first.

Frequently asked questions

Can PESU replace PEI?

In most data-centre parts, yes. The two are same-tier amorphous, inherently flame-retardant resins with overlapping processing windows, and PESU leads on heat, impact and arc-ignition items. The exceptions are parts that require UL94 V-0 at 0.75 mm wall thickness and high-speed electrical connector housings carrying GHz signals, where PEI has the advantage. Send the part drawing and specification requirements and we will assign a grade.

Which has the higher heat resistance, PESU or PEI?

PESU. Glass transition 225 vs 217°C (ISO 11357), heat deflection 205 vs 192°C (ISO 75, 1.8 MPa), and UL 746B relative temperature index 180 vs 170°C for electrical and impact and 190 vs 170°C for strength. All are same-basis values from the makers' TDS and UL Yellow Cards.

PESU is less stiff than PEI — is that a problem?

It depends on what the part does. Tensile modulus is 3,200 MPa for PEI and 2,640 MPa for PESU, about 20% higher for PEI, so a thin, long structural part that must not deflect suits PEI. A snap-fit or latch that bends repeatedly has more margin against fracture in PESU, thanks to its lower modulus, higher yield strain (6.9 vs 6%) and nearly double notched impact (7.5 vs 4 kJ/m²).

Which flows better?

The makers test melt flow under different conditions, so the datasheet figures cannot be compared directly. In conversions that ran PEI moulds on PESU, in Korea and abroad, better thin-wall fill and surface have been reported, and E 1010 is the low-viscosity grade BASF positions for thin-wall connectors (MVR 150). A short-shot trial in the existing mould is the surest check; Octud supplies evaluation samples.

Is PESU UL94 V-0 too?

Yes, without flame-retardant additives, but the minimum thickness differs. E 2010 is V-0 at 1.5 mm and 5VA at 3 mm; E 1010 is V-1 at 1.5 mm and V-0 at 3 mm. ULTEM is V-0 at 0.75 mm. If V-0 is required at 1 mm or below, narrow the choice to E 2010 or BASF's D series (PESU blend) and confirm.

PEI supply is said to be unsettled — what about PESU?

BASF produces Ultrason to the same specification in Ludwigshafen, Germany and at its Yeosu plant in Korea, on stream since 2014 and expanded in 2018 to a global capacity of 24,000 t/a. Domestic production removes sea freight and customs variables, and Octud holds E 1010 and E 2010 in local stock. Tell us the quantity and monthly usage and we will confirm stock and lead time immediately.

Which approvals must be repeated when converting to PESU?

When the material changes, UL component recognition (the Yellow Card covers the material; the end product is certified separately), connector-standard testing (IEC 61754 and the like) and customer approval tests must be repeated. Octud provides a conversion-review package of TDS, UL Yellow Cards and BASF application literature, plus evaluation samples.

What is the difference between Ultrason E 1010 and E 2010?

Viscosity. E 1010 is the low-viscosity, high-flow grade (MVR 150) for thin-wall parts such as fibre-optic connectors; E 2010 is the standard-viscosity grade (MVR 70) that holds UL94 V-0 at 1.5 mm, 5VA at 3 mm and HAI PLC 0, suited to power-distribution and general moulded parts. Thermal and electrical properties are almost identical.

Food-contact recertification — from material to documents

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※ Written by Octud from values published in the BASF Ultrason E 1010 NAT and E 2010 NAT TDS and UL Yellow Card E41871 (February 2026 edition), the SABIC ULTEM 1000 and 1010 Global TDS and UL Yellow Card E121562 (2026 edition), SABIC 'Consider ULTEM resins as an alternative solution to sulfone polymers' (2023), BASF 'Ultrason® for your special component in the E&E industry' (2023) and the BASF Ultrason E&E web page, and BASF news release P163/18e (April 2018). Figures are typical values, not specification limits. The three-tier plastics classification is the industry's. The statements on reported flow improvement and unsettled PEI supply are based on conversion cases and enquiries received by Octud, not on official manufacturer literature. The part-by-part verdicts are Octud's commentary based on datasheets and maker application literature and do not replace part-level standard testing, UL end-product certification or customer approval. All photos are BASF press images. Ultrason® is a trademark of BASF; ULTEM™ is a trademark of SABIC.

Tritan™ and Eastar™ are trademarks of Eastman Chemical Company, INFINO® of Lotte Chemical, and Ultrason® of BASF SE. Competitor product names are used solely for factual identification and comparison, and do not imply affiliation or endorsement.

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